multiphysics simulations Search Results


multiphysics 6.2 model assistant  (COMSOL Inc)
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COMSOL Inc multiphysics 6.2 model assistant
Multiphysics 6.2 Model Assistant, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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comsol multiphysics simulations  (COMSOL Inc)
90
COMSOL Inc comsol multiphysics simulations
Comsol Multiphysics Simulations, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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simulation software package comsol multiphysics r¹ 3.4  (COMSOL Inc)
90
COMSOL Inc simulation software package comsol multiphysics r¹ 3.4
Simulation Software Package Comsol Multiphysics R¹ 3.4, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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3-dimensional fluidic simulations comsol multiphysics  (COMSOL Inc)
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COMSOL Inc 3-dimensional fluidic simulations comsol multiphysics
3 Dimensional Fluidic Simulations Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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ray tracing algorithm in comsol multiphysics  (COMSOL Inc)
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COMSOL Inc ray tracing algorithm in comsol multiphysics
Ray Tracing Algorithm In Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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3d finite element simulations of the resulting electric fields comsol multiphysics  (COMSOL Inc)
90
COMSOL Inc 3d finite element simulations of the resulting electric fields comsol multiphysics
3d Finite Element Simulations Of The Resulting Electric Fields Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics simulations of microfluidic channels  (COMSOL Inc)
90
COMSOL Inc multiphysics simulations of microfluidic channels
Illustration of <t>Microfluidic</t> Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.
Multiphysics Simulations Of Microfluidic Channels, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics simulations of microfluidic channels - by Bioz Stars, 2026-03
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full-wave comsol simulator  (COMSOL Inc)
90
COMSOL Inc full-wave comsol simulator
Illustration of <t>Microfluidic</t> Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.
Full Wave Comsol Simulator, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multi-physics object-oriented simulation environment (moose) framework  (Idaho National Laboratory)
90
Idaho National Laboratory multi-physics object-oriented simulation environment (moose) framework
Illustration of <t>Microfluidic</t> Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.
Multi Physics Object Oriented Simulation Environment (Moose) Framework, supplied by Idaho National Laboratory, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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simulations of the electrode configuration using comsol multiphysics  (COMSOL Inc)
90
COMSOL Inc simulations of the electrode configuration using comsol multiphysics
Illustration of <t>Microfluidic</t> Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.
Simulations Of The Electrode Configuration Using Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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simulation multiphysics  (Autodesk Inc)
90
Autodesk Inc simulation multiphysics
Illustration of <t>Microfluidic</t> Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.
Simulation Multiphysics, supplied by Autodesk Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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computational fluid dynamics simulation package comsol multiphysics v6.2  (COMSOL Inc)
90
COMSOL Inc computational fluid dynamics simulation package comsol multiphysics v6.2
Illustration of <t>Microfluidic</t> Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.
Computational Fluid Dynamics Simulation Package Comsol Multiphysics V6.2, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Average 90 stars, based on 1 article reviews
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Image Search Results


Illustration of Microfluidic Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.

Journal: Cells

Article Title: A Microfluidic Flip-Chip Combining Hydrodynamic Trapping and Gravitational Sedimentation for Cell Pairing and Fusion

doi: 10.3390/cells10112855

Figure Lengend Snippet: Illustration of Microfluidic Flip-Chip ( A ) Image shows the fabricated MFC using a soft lithography process along with the illustration. ( B ) A graphic illustration of the MFC shows the three-layered structure with PDMS channels as the top layer, through-hole membrane as the middle layer, and titanium electrodes as the third bottom layer. ( C ) The parameters affecting chip performance—the PDMS membrane thickness (t m ), the diameter of fusion well (d w ), the distance between adjacent wells (d aw ), the distance between electrodes (d), and the distance between adjacent electrodes (d ae ) are as shown. Scale bar: 200 µm.

Article Snippet: COMSOL Multiphysics simulations of microfluidic channels, Figure S3.

Techniques: Membrane